The current manufacturing of semiconductor devices faces limitations in precise thermal processing, especially in film deposition steps such as chemical vapor deposition (CVD) and etching require fast heating and cooling of the semiconductor wafers. Conventional heating systems often struggle with achieving uniform temperature distribution, particularly when addressing circumferential temperature inconsistencies caused by varying environmental/processing conditions. The use of fluorine-containing gases in semiconductor processing frequently accelerates the degradation of ceramic components, leading to earlier replacements and increased maintenance costs. With the growing demand of high-performance computing, AI, and data centres, there is an increasing need for semiconductor processing components such as heaters which offer an advanced thermal solution. Advanced ceramic heaters will enable a rapid and uniform heating and cooling within a wide temperature range. Additionally, it has to be mentioned that most of the competence for manufacturing of heaters is available in non-European countries such as South Korea, Japan as well as the US. The project focuses on designing and manufacturing of advanced ceramic heaters for wafer deposition processes which are critical to advanced semiconductor technologies. These are used for processing of semiconductors for applications such as 5G, AI, autonomous systems, and data storage. Achieving uniform temperature distribution on large wafers is essential in order to obtain high-precision thin films and to obtain a high yield in the processing. Different standard as well as multi-zone heaters will be designed and for the manufacturing additive manufacturing combined with advanced sintering technologies will be used. Advanced versions of heaters include integrated cooling solutions capable of operating across an extended temperature range of to 800°C and allowing fast heating and cooling and which are more resistant to etching gases applied during the process. To overcome this, modified ceramic compositions will be investigated in combination with use of feedstock based 3D printing technologies allowing to fabricate multicomponent ceramics where electrical conductive vias are embedded in a non electrically conductive ceramic matrix. In total 3 different product families will be designed, manufactured and evaluated.